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• The metal mask applied to the producing process of LED&OLED in optoelectronic industry, and the wafer in semi-conductor.
• Etching:
The bore is ≧ material thickness. Ex. If the thickness is 0.04 mm, then the minimum bore would be 0.04 mm.
The materials we provide are the Invar 36 and the stainless steel, Sus304 430.
Mass Production: 620 x 375 mm
• Frame processing is available.
